Hole-filling copper plating solution, preparation method thereof and hole-filling copper plating method

• Main Authors: LU WENXIN, DU TENGHUI, TAN WENLING
• Format: Patent
• Language: Chinese; English
• Published: 10.11.2023
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention provides a porefilling copper plating solution, a preparation method thereof and a porefilling copper plating method. According to the hole-filling copper plating solution, a good hole-filling effect is achieved, 3 mil laser holes, 4 mil laser holes and 5 mil laser holes are filled at the same time, and the dimp value is smaller than 15 micrometers. The hole-filling copper plating solution has good deep plating capacity for through holes, specifically, for holes with the AR value of 6: 1 and the hole diameter of 0.2 mm, TPmin is 71.05%; and for the holes with the AR value of 3: 1 and the aperture of 0.3 mm, the TPmin is 83.91%. The hole-filling copper plating solution is fine in copper plating crystal and good in ductility. The invention further provides a preparation method of the porefilling copper plating solution and a porefilling copper plating method. 本发明提供了一种填孔镀铜液及其制备方法和填孔镀铜方法。根据本发明的填孔镀铜液，有良好的填孔效果，同时填3、4、5mil镭射孔，dimple值小于15μm。本发明的填孔镀铜液，对于通孔有良好的深镀能力，具体而言，对于AR值6:1，孔径0.2mm的孔，TPmin：71.05％；对于A