Electronic device assembly

• Main Authors: JEON OSEOB, IM SEUNG-WON
• Format: Patent
• Language: Chinese; English
• Published: 07.11.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An electronic device assembly includes a substrate having a surface, a patterned metal layer disposed on the surface of the substrate, a semiconductor device circuit implemented on the patterned metal layer, and a molded body including a plurality of signal pins. A signal pin of the plurality of signal pins includes a first portion protruding from the first surface of the molded body. The first portion is accessible from the outside. The signal pin of the plurality of signal pins also includes a second portion protruding from a second surface of the molded body opposite the first surface. A second portion of a single signal pin of the plurality of signal pins is located inside the electronic device assembly, electrically coupled with the patterned metal layer, and electrically continuous with the first portion. 本申请涉及电子器件组件，该电子器件组件包括具有表面的衬底、设置在衬底的表面上的图案化金属层、实现在图案化金属层上的半导体器件电路、以及包括多个信号引脚的模制体。多个信号引脚中的信号引脚包括第一部分，所述第一部分从模制体的第一表面伸出。第一部分从外部可及。多个信号引脚中的信号引脚还包括第二部分，所述第二部分从模制体的与第一表面相对的第二表面伸出。多个信号引脚中的单个信号引脚的第二部分位于电子器件组件的