Epoxy resin, preparation method thereof and resin composition

• Main Authors: LIU CHENGJIE, ZHANG JUNYING, ZHANG PENGBO, XU WEINA
• Format: Patent
• Language: Chinese; English
• Published: 07.11.2023
• Subjects: ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC CHEMISTRY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

The epoxy resin provided by the embodiment of the invention comprises a cyclic siloxane ring and at least one group which is connected with a silicon atom on the cyclic siloxane ring and is shown as a formula (A), in the # imgabs0 # formula (A), Z is substituted or unsubstituted arylene; n is an integer greater than or equal to 2. The molecular structure of the epoxy resin simultaneously has a cyclic siloxane ring and an epoxy group which is connected with the cyclic siloxane ring, is shown in a formula (A) and contains an arylene structure, and the epoxy resin has the advantages of low viscosity, low dielectric, low water absorption, high flexibility and higher glass transition temperature Tg; the material can be applied to the field of electronic sealing packaging as a sealing packaging material, and sealing packaging reliability is effectively improved. 本申请实施例提供一种环氧树脂，包括环状硅氧烷环和至少一个与环状硅氧烷环上的硅原子连接的式(A)所示的基团，#imgabs0#式(A)中，Z为取代或未取代的亚芳基；n为大于或等于2的整数。该环氧树脂分子结构中同时具有环状硅氧烷环和与环状硅氧烷环连接的式(A)所示的含有亚芳基结构的环氧基团，该环氧树脂可具备低粘度