Semiconductor plastic packaging system and foreign matter detection method

• Main Authors: WANG DESEN, FENG ZHIGANG
• Format: Patent
• Language: Chinese; English
• Published: 03.11.2023
• Subjects: BASIC ELECTRIC ELEMENTS; DETECTING MASSES OR OBJECTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; MEASURING; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

The invention relates to the field of packaging, and discloses a semiconductor plastic packaging system and a foreign matter detection method.The semiconductor plastic packaging system comprises plastic packaging equipment and a foreign matter detection device, and the foreign matter detection device comprises an image collector and a controller; the image collector is used for collecting a target image of the lead frame to be plastically packaged in the feeding area; the feeding area is located in the plastic packaging equipment; and the controller is used for presetting a standard image, comparing the target image with the standard image, and judging whether foreign matters exist in the non-plastic package area of the target image or not. The image collector can collect the image of the to-be-plastically-packaged lead frame before plastic packaging, and the controller compares and analyzes the image of the to-be-plastically-packaged lead frame before plastic packaging with the standard image to identify whe