Cyanide-free electroplating solution for preparing imitation shallow gold zipper, electroplating method of cyanide-free electroplating solution and composite coating
The invention discloses a cyanide-free electroplating solution for preparing an imitation shallow gold zipper, an electroplating method of the cyanide-free electroplating solution and a composite coating. The cyanide-free electroplating solution only takes copper salt and tin salt as main salts, the...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
03.11.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses a cyanide-free electroplating solution for preparing an imitation shallow gold zipper, an electroplating method of the cyanide-free electroplating solution and a composite coating. The cyanide-free electroplating solution only takes copper salt and tin salt as main salts, the copper ion concentration is 0.15-0.3 mol/L, and the tin ion concentration is 0.04-0.1 mol/L; potassium pyrophosphate is used as a main complexing agent, and the concentration is 250-350 g/L; the electroplating liquid does not contain gold salt with high price, only copper salt and tin salt are specifically prepared, meanwhile, a plurality of specific complexing agents are supplemented, and then a brightening agent-mercaptoazole organic matter is combined, so that crystal nucleuses formed by the cyanide-free electroplating liquid in the electroplating process are densely distributed, and the electroplating effect is good. The cyanide-free electroplating solution has the advantages of simple composition, strong unif |
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Bibliography: | Application Number: CN202310997574 |