Boiling plate and computing system

The invention discloses a boiling plate and a computing system. The boiling plate comprises a first surface and a second surface. The first surface is configured to contact a thermal component. The second surface is opposite to the first surface, and the second surface is configured to contact a liq...

Full description

Saved in:
Bibliographic Details
Main Authors ZHUANG TIANRUI, CHEN CHAORONG, LIN YONGQING, HUANG YUNIAN
Format Patent
LanguageChinese
English
Published 31.10.2023
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
Online AccessGet full text

Cover

More Information
Summary:The invention discloses a boiling plate and a computing system. The boiling plate comprises a first surface and a second surface. The first surface is configured to contact a thermal component. The second surface is opposite to the first surface, and the second surface is configured to contact a liquid medium. The second surface has a plurality of tapered cavities including a first tapered cavity and a second tapered cavity. A distance between a first axis of the first conical cavity and a second axis of the second conical cavity is separated by a minimum spacing that is four times a radius of the first conical cavity or the second conical cavity. 本发明公开一种沸腾板以及计算系统，其中该沸腾板包括一第一表面以及一第二表面。第一表面设置以接触一热组件。第二表面与第一表面相对，并且第二表面设置以接触一液体介质。第二表面具有多个锥形腔，包括一第一锥形腔以及一第二锥形腔。第一锥形腔的一第一轴与第二锥形腔的一第二轴之间的一距离通过第一锥形腔或第二锥形腔的一半径的四倍的一最小间距分隔。
Bibliography:Application Number: CN202211333063