Heat absorption case, electronic component and method for manufacturing heat absorption case

• Main Authors: ZENG BAIKAI, WANG DEQUAN, CHEN YIJIE, WU YUEZHANG
• Format: Patent
• Language: Chinese; English
• Published: 27.10.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention discloses an endothermic chassis, an electronic component, and a method of making the endothermic chassis, such as a heat transfer chassis for a component without a fan device (e.g., a fifth generation mobile communication technology component). The chassis includes a heat dissipation section having an inner surface and an outer surface. The inner surface is configured to contact a heating electronic device. A transverse hollow chamber is located near the interior surface. A coolant is contained in the hollow chamber. 本发明公开一种吸热机箱、电子组件、以及制作吸热机箱的方法，例如一种用于一不具风扇设备的组件(例如一第五代移动通信技术组件)的热传输机箱。所述机箱包括一散热区段，具有一内部表面以及一外部表面。内部表面配置以接触一发热电子装置。一横向中空腔室位于内部表面附近。一冷却剂被容纳于中空腔室中。