Wafer processing apparatus, cleaning apparatus, and cleaning method

The invention provides a wafer processing apparatus, a cleaning apparatus and a cleaning method. Processing chips are prevented from adhering to the periphery of a wafer and damage to the periphery of the wafer. The wafer is cleaned through: a preparation step of rotating a rotary table (10), which...

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Bibliographic Details
Main Author TAKEGAWA MAHIRO
Format Patent
LanguageChinese
English
Published 27.10.2023
Subjects
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:The invention provides a wafer processing apparatus, a cleaning apparatus and a cleaning method. Processing chips are prevented from adhering to the periphery of a wafer and damage to the periphery of the wafer. The wafer is cleaned through: a preparation step of rotating a rotary table (10), which holds the wafer on a holding surface (11a), about the center of the holding surface as an axis, and positioning a two-fluid nozzle (30) such that two fluids ejected from the two-fluid nozzle fall on the center of the holding surface; an upper surface cleaning step of moving the two-fluid nozzle at a predetermined speed in the radial direction of the wafer while discharging the two fluids from the two-fluid nozzle, and cleaning the upper surface of the wafer held by the holding surface; and an outer periphery cleaning step of moving the two-fluid nozzle to a position where the two-fluid ejected from the two-fluid nozzle moving in the radial direction of the wafer is in contact with the outer periphery of the wafer,
Bibliography:Application Number: CN202310416862