Organometallic compound for thin film deposition and method for forming group 4 metal-containing thin film using same

According to an example of the present disclosure, an organometallic compound is represented by the following Formula 1, which is used as a precursor when depositing a Group 4 metal-containing thin film to provide a high quality Group 4 metal-containing thin film. [Formula 1] # imgabs0 # in Formula...

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Main Authors JI SUNG-JUN, LI TAIRONG, JUNG JOO-HWAN, KIM SHIN BEOM, BAEK SUN-YOUNG, CHO KYU-HO, CHOI WOONG-JIN
Format Patent
LanguageChinese
English
Published 27.10.2023
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Abstract According to an example of the present disclosure, an organometallic compound is represented by the following Formula 1, which is used as a precursor when depositing a Group 4 metal-containing thin film to provide a high quality Group 4 metal-containing thin film. [Formula 1] # imgabs0 # in Formula 1, M is Zr or Hf, R1 is selected from the group consisting of a linear alkyl group having 2 to 6 carbon atoms and a branched alkyl group having 3 to 6 carbon atoms, R2 is a linear alkyl group having 1 to 3 carbon atoms, and R1 and R2 are different from each other. 根据本公开的示例,有机金属化合物由下式1表示,其在沉积含第4族金属的薄膜时用作前体,以提供高质量的含第4族金属的薄膜。[式1]#imgabs0#在式1中,M为Zr或Hf,R1选自具有2至6个碳原子的直链烷基和具有3至6个碳原子的支链烷基,R2为具有1至3个碳原子的直链烷基,并且R1和R2彼此不同。
AbstractList According to an example of the present disclosure, an organometallic compound is represented by the following Formula 1, which is used as a precursor when depositing a Group 4 metal-containing thin film to provide a high quality Group 4 metal-containing thin film. [Formula 1] # imgabs0 # in Formula 1, M is Zr or Hf, R1 is selected from the group consisting of a linear alkyl group having 2 to 6 carbon atoms and a branched alkyl group having 3 to 6 carbon atoms, R2 is a linear alkyl group having 1 to 3 carbon atoms, and R1 and R2 are different from each other. 根据本公开的示例,有机金属化合物由下式1表示,其在沉积含第4族金属的薄膜时用作前体,以提供高质量的含第4族金属的薄膜。[式1]#imgabs0#在式1中,M为Zr或Hf,R1选自具有2至6个碳原子的直链烷基和具有3至6个碳原子的支链烷基,R2为具有1至3个碳原子的直链烷基,并且R1和R2彼此不同。
Author JI SUNG-JUN
CHO KYU-HO
LI TAIRONG
KIM SHIN BEOM
BAEK SUN-YOUNG
CHOI WOONG-JIN
JUNG JOO-HWAN
Author_xml – fullname: JI SUNG-JUN
– fullname: LI TAIRONG
– fullname: JUNG JOO-HWAN
– fullname: KIM SHIN BEOM
– fullname: BAEK SUN-YOUNG
– fullname: CHO KYU-HO
– fullname: CHOI WOONG-JIN
BookMark eNqNjc0KwjAQhHPQg3_vsD5AD8Wi9ChF8aQX7yWk23Yh2Q1N8v6mKnj1MAzDfMys1YKFcaXSYxo0i8OorSUDRpyXxB30MkEciaEn66BDL4EiCYPOZcZH-TBZjniAYZLkoYL3UmGEoyaei99ICnMO2uFWLXttA-6-vlH76-XZ3Ip802Lw2iBjbJt7WR7rqq7K0_nwD_MCXkBHAw
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
DocumentTitleAlternate 用于薄膜沉积的有机金属化合物及使用该化合物形成含第4族金属的薄膜的方法
ExternalDocumentID CN116949417A
GroupedDBID EVB
ID FETCH-epo_espacenet_CN116949417A3
IEDL.DBID EVB
IngestDate Fri Jul 19 13:11:36 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language Chinese
English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_CN116949417A3
Notes Application Number: CN202310440248
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231027&DB=EPODOC&CC=CN&NR=116949417A
ParticipantIDs epo_espacenet_CN116949417A
PublicationCentury 2000
PublicationDate 20231027
PublicationDateYYYYMMDD 2023-10-27
PublicationDate_xml – month: 10
  year: 2023
  text: 20231027
  day: 27
PublicationDecade 2020
PublicationYear 2023
RelatedCompanies EGTM LIMITED
RelatedCompanies_xml – name: EGTM LIMITED
Score 3.633618
Snippet According to an example of the present disclosure, an organometallic compound is represented by the following Formula 1, which is used as a precursor when...
SourceID epo
SourceType Open Access Repository
SubjectTerms CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Title Organometallic compound for thin film deposition and method for forming group 4 metal-containing thin film using same
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231027&DB=EPODOC&locale=&CC=CN&NR=116949417A
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1dT8IwFL1BNOqbokbxIzUxe1tkrGzdw2KkgxATBjFoeCMdtICBQWTExF_vbQHhRd-WdbnpbnJ7z9ZzegAenESJQAykHbgI32hFKVuwUmAnTPaZthVgQouTm7HXeKMv3Uo3Bx8bLYw5J_TLHI6IFdXHes_Mej3f_sSKDLdy8ZiM8dbsqd4JI2v9dazBStm3ompYa7eiFrc4D3lsxa-h43gBDajjP-_BPsJoX1dD7b2qVSnz3ZZSP4GDNkZLs1PIfY8KcMQ3zmsFOGyuN7zxcl17izNYGtnkbIrzmuAkiSaDa08kgrCTZKNxStR4MiUDueFhEYGDK4do84yGp9ioiBFyEEpMJFtz1VcuETtBNBt-SBZiKs_hvl7r8IaNYXu_yerxePuq7gXk01kqL4HoDU9XKqEUq1CqGBOBGpSk4wlPUL9Er6D4d5zif4PXcKwTr9fzsn8D-exzKW-xUWfJncnwD5XdmpE
link.rule.ids 230,309,783,888,25576,76876
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1dT8IwFL1BNOKbogbxqyZmb4sMyj4eFiMdBBUGMWh4Ix20goFBZMTEX-9tAeFF35Z1Oena3N679ZwegFsrktzjA2F6JSzfaFlKk7sFz4xc0XeVrYDLlTi5Gdr1V_rULXdT8LHWwuhzQr_04YgYUX2M90Sv17PNT6xAcyvnd9EIb03vax0_MFZfx6pYKTpGUPGr7VbQYgZjPguN8MW3LNujHrWchx3YxRLbUdFQfasoVcpsO6XUDmGvjWhxcgSp72EWMmztvJaF_eZqwxsvV7E3P4aFlk1OJ9ivMXaSKDK48kQiWHaSZDiKiRyNJ2Qg1jwswrFx6RCtn1HlKSYqooUchBKNZCqu-tIlYgtEseHfyZxPxAnc1KodVjcRtvc7WD0Wbl61dArpeBqLHBC14VkSkkvplimVrss9OSgIy-Y2p06BnkH-b5z8f43XkKl3mo1e4zF8PocDNQlqbS86F5BOPhfiEpN2El3p0f4BAxWdhA
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Organometallic+compound+for+thin+film+deposition+and+method+for+forming+group+4+metal-containing+thin+film+using+same&rft.inventor=JI+SUNG-JUN&rft.inventor=LI+TAIRONG&rft.inventor=JUNG+JOO-HWAN&rft.inventor=KIM+SHIN+BEOM&rft.inventor=BAEK+SUN-YOUNG&rft.inventor=CHO+KYU-HO&rft.inventor=CHOI+WOONG-JIN&rft.date=2023-10-27&rft.externalDBID=A&rft.externalDocID=CN116949417A