Organometallic compound for thin film deposition and method for forming group 4 metal-containing thin film using same
According to an example of the present disclosure, an organometallic compound is represented by the following Formula 1, which is used as a precursor when depositing a Group 4 metal-containing thin film to provide a high quality Group 4 metal-containing thin film. [Formula 1] # imgabs0 # in Formula...
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Main Authors | , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
27.10.2023
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Subjects | |
Online Access | Get full text |
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Summary: | According to an example of the present disclosure, an organometallic compound is represented by the following Formula 1, which is used as a precursor when depositing a Group 4 metal-containing thin film to provide a high quality Group 4 metal-containing thin film. [Formula 1] # imgabs0 # in Formula 1, M is Zr or Hf, R1 is selected from the group consisting of a linear alkyl group having 2 to 6 carbon atoms and a branched alkyl group having 3 to 6 carbon atoms, R2 is a linear alkyl group having 1 to 3 carbon atoms, and R1 and R2 are different from each other.
根据本公开的示例,有机金属化合物由下式1表示,其在沉积含第4族金属的薄膜时用作前体,以提供高质量的含第4族金属的薄膜。[式1]#imgabs0#在式1中,M为Zr或Hf,R1选自具有2至6个碳原子的直链烷基和具有3至6个碳原子的支链烷基,R2为具有1至3个碳原子的直链烷基,并且R1和R2彼此不同。 |
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Bibliography: | Application Number: CN202310440248 |