Organometallic compound for thin film deposition and method for forming group 4 metal-containing thin film using same

According to an example of the present disclosure, an organometallic compound is represented by the following Formula 1, which is used as a precursor when depositing a Group 4 metal-containing thin film to provide a high quality Group 4 metal-containing thin film. [Formula 1] # imgabs0 # in Formula...

Full description

Saved in:
Bibliographic Details
Main Authors JI SUNG-JUN, LI TAIRONG, JUNG JOO-HWAN, KIM SHIN BEOM, BAEK SUN-YOUNG, CHO KYU-HO, CHOI WOONG-JIN
Format Patent
LanguageChinese
English
Published 27.10.2023
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:According to an example of the present disclosure, an organometallic compound is represented by the following Formula 1, which is used as a precursor when depositing a Group 4 metal-containing thin film to provide a high quality Group 4 metal-containing thin film. [Formula 1] # imgabs0 # in Formula 1, M is Zr or Hf, R1 is selected from the group consisting of a linear alkyl group having 2 to 6 carbon atoms and a branched alkyl group having 3 to 6 carbon atoms, R2 is a linear alkyl group having 1 to 3 carbon atoms, and R1 and R2 are different from each other. 根据本公开的示例,有机金属化合物由下式1表示,其在沉积含第4族金属的薄膜时用作前体,以提供高质量的含第4族金属的薄膜。[式1]#imgabs0#在式1中,M为Zr或Hf,R1选自具有2至6个碳原子的直链烷基和具有3至6个碳原子的支链烷基,R2为具有1至3个碳原子的直链烷基,并且R1和R2彼此不同。
Bibliography:Application Number: CN202310440248