High-temperature semiconductor die bonding soldering paste and preparation method thereof

• Main Authors: GU YINGYING, XUE GUANGWEI, HUA RENXI
• Format: Patent
• Language: Chinese; English
• Published: 27.10.2023
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention discloses a high-temperature semiconductor die bonding soldering paste and a preparation method thereof, the high-temperature semiconductor die bonding soldering paste comprises active resin, scaling powder prepared from metal powder uniformly distributed in the active resin, an active agent and a solvent, and the high-temperature semiconductor die bonding soldering paste comprises the following components in percentage by weight: 60-70% of the active resin, 5-10% of the scaling powder, 10-15% of the active agent and 5-10% of the solvent. In the soldering flux, the silver powder is a key component for improving the electrical conductivity and the thermal conductivity, so that the welding effect is more stable and reliable, the diphenyl palladium oxide can serve as a catalyst and can promote the proceeding of a welding reaction, the cyclohexanone serves as a solvent and can adjust the viscosity and the fluidity of paste, welding operation is facilitated, and the soldering efficiency is improved.