Laser polishing method and device for surface of cultivated diamond

• Main Authors: JIANG LIJIA, JIANG SHIBIN, DU SHAN, XUAN TING, ZHU XIAONONG, LI XIA
• Format: Patent
• Language: Chinese; English
• Published: 27.10.2023
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention discloses a laser polishing method and device for a cultivated diamond surface, and belongs to the field of diamond polishing. Comprising a laser; the focusing optical element is used for focusing the light beam to form a laser spot; the optical scanning mechanism is used for controlling the space scanning position and track of the light beam, so that the laser spots form laser rays; and the moving carrier is used for enabling the to-be-polished diamond material to move along a preset track, so that the movement range of the laser rays on the polishing surface of the to-be-polished diamond material covers the polishing surface. The processing technology and device for polishing the surface of the diamond by using the ultrafast laser have the beneficial effects that the problem that carbonization layers are generated on the corrugated surface and the cutting surface of the growth surface of the traditional cultivated diamond is solved. 本申请公开了一种培育金刚石表面激光抛光方法及装置，其属于金刚石抛光领域。包括：激光器；聚焦光学元件，用于对光束进行聚焦形成