Chip and electronic device

The embodiment of the invention provides a chip and electronic equipment, and relates to the field of electronics. A chip of the present disclosure includes a processor, a memory, and an interposer. The processor has a first surface and an opposing second surface. The interposer includes a first bum...

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Bibliographic Details
Main Authors LI YINING, LIANG CHUANZENG
Format Patent
LanguageChinese
English
Published 24.10.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The embodiment of the invention provides a chip and electronic equipment, and relates to the field of electronics. A chip of the present disclosure includes a processor, a memory, and an interposer. The processor has a first surface and an opposing second surface. The interposer includes a first bump region, a second bump region, and a third bump region. The first bump region is located on the first surface and coupled to the processor, and the first bump region includes a plurality of first bumps. The second bump region is located on the first surface and coupled to the memory. The second bump region includes a plurality of second bumps. The third bump region is located at the second surface and includes a plurality of third bumps. The interposer includes a plurality of first transmission lines and a plurality of second transmission lines extending internally. The first transmission lines are respectively coupled to the plurality of first bumps and the plurality of second bumps. The second transmission lines
Bibliography:Application Number: CN202210359390