Method for manufacturing electrolytic copper foil with rugby-like copper nodules and circuit board assembly

• Main Authors: ZOU MINGREN, LIN SHIQING, DENG MINGKAI
• Format: Patent
• Language: Chinese; English
• Published: 24.10.2023
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention discloses an electrolytic copper foil with rugby-like copper nodules and a manufacturing method of a circuit board assembly. The manufacturing method of the electrolytic copper foil comprises the following steps: forming a raw foil layer through an electrolysis method, wherein the raw foil layer is provided with a preset surface; then, a roughening treatment layer is formed on the preset surface of the raw foil layer, the roughening treatment layer comprises a plurality of rugby-shaped copper nodules, and an approximately funnel-shaped containing space is formed between every two adjacent rugby-shaped copper nodules; the step of forming the roughening treatment layer comprises executing first electroplating roughening treatment, first electroplating curing treatment, second electroplating roughening treatment and second electroplating curing treatment, and the current density of the second electroplating roughening is larger than that of the first electroplating roughening. A first electroplatin