Organopolysiloxane, organopolysiloxane composition, preparation method of organopolysiloxane composition, flexible semiconductor device and thin film packaging method of flexible semiconductor device

• Main Authors: LI DELIN, SUN FENGZHEN, LIN YOUQIANG
• Format: Patent
• Language: Chinese; English
• Published: 24.10.2023
• Subjects: ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC CHEMISTRY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

The invention discloses organopolysiloxane, an organopolysiloxane composition, a preparation method of the organopolysiloxane composition, a flexible semiconductor device and a thin film packaging method of the flexible semiconductor device. The organopolysiloxane has a special chemical structure, and the organopolysiloxane composition is prepared from the following components in parts by weight: 5 to 90 parts of organopolysiloxane, 15 to 80 parts of reactive diluent and 0.1 to 10 parts of photoinitiator. The organopolysiloxane composition prepared by adopting organopolysiloxane with a specific structure as a main component of the flexible semiconductor device packaging material and cooperating with other components has low water vapor transmittance and high light transmittance at the same time. 本发明公开了一种有机聚硅氧烷、有机聚硅氧烷组合物及其制备方法、柔性半导体器件及其薄膜封装方法。该有机聚硅氧烷具有特殊的化学结构，该有机聚硅氧烷组合物包括:有机聚硅氧烷5-90份、活性稀释剂15-80份、光引发剂0.1-10份。通过采用具有特定结构的有机聚硅氧烷作为柔性半导体器件封装材料的主要组分，配合其他组分制备得到有机聚硅氧烷组合物同时具有低水气透过率和高透光率。