Apparatus for post-exposure baking of photoresist

• Main Authors: LUBOMIRSKY DMITRY, DUKOVICH, JOHN, O, SRINIVASA D NEMANI, DOUGLAS A. BUCHBERGER JR
• Format: Patent
• Language: Chinese; English
• Published: 20.10.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS

Provided herein are methods and apparatus for applying an electric and/or magnetic field to a photoresist layer during a lithographic process without air gap intervention. Each of these methods and apparatuses includes an electrode assembly and a base assembly configured to be sealed together and form a process volume. The electrode assembly includes a permeable electrode, and the base assembly is configured to support a substrate and heat the substrate during a post-exposure baking operation. One or more process fluid channels are configured to fill the process volume with a process fluid. The electrode assembly is configured to apply an electric field to the substrate disposed within the process volume during a post-exposure baking operation. 本文提供了一种方法和设备，用于在光刻工艺期间将电场和/或磁场施加到光刻胶层，而没有气隙干预。这些方法和设备中的每一者包括电极组件和底座组件，电极组件和底座组件被配置为密封在一起并且形成工艺容积。所述电极组件包括可渗透的电极，所述底座组件被配置为支撑基板并且在暴露后烘烤操作期间加热所述基板。一个或多个工艺流体通道被配置为用工艺流体填充所述工艺容积。所述电极组件被配置为在暴露后烘烤操作期间将电场施加到设置在所述工艺容积内的所述基板。