System and method for semiconductor defect guided presintering and system-level testing

Systems and methods for semiconductor defect guided burn-in and system-level testing (SLT) are configured to receive a plurality of in-line defect portion averaging test (I-PAT) scores from an in-line defect portion averaging test (I-PAT) subsystem, where the plurality of I-PAT scores are generated...

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Bibliographic Details
Main Authors RATHERT ROBERT J, LENNOX CHRISTOPHER V, ROBINSON JOHN, PRICE DAVID W, DONZELLA, OLIVIER
Format Patent
LanguageChinese
English
Published 20.10.2023
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Summary:Systems and methods for semiconductor defect guided burn-in and system-level testing (SLT) are configured to receive a plurality of in-line defect portion averaging test (I-PAT) scores from an in-line defect portion averaging test (I-PAT) subsystem, where the plurality of I-PAT scores are generated by the I-PAT subsystem based on semiconductor die data for a plurality of semiconductor dies, wherein the semiconductor die data includes characterization measurements of the plurality of semiconductor dies, and wherein each I-PAT score of the plurality of I-PAT scores represents a defect rate determined by the I-PAT subsystem based on the characterization measurements of a corresponding semiconductor die of the plurality of semiconductor dies; applying one or more rules to the plurality of I-PAT scores during a dynamic decision process; and generating one or more defect guide placement for at least one of the plurality of semiconductor dies based on the dynamic decision process. 用于半导体缺陷引导预烧及系统级测试(SLT)的系统及方法经配置以:从线
Bibliography:Application Number: CN202280018257