IC PACKAGE WITH EMBEDDED LIQUID-BASED COOLING SYSTEM

The disclosed IC package may include: (1) an IC die carrying an electronic circuit; (2) an encapsulation material at least partially covering the IC die wherein (a) the encapsulation material defines a plurality of microchannels within the encapsulation material, and (b) the plurality of microchanne...

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Bibliographic Details
Main Authors VIJAYRAO NARSING KRISHNA, MORTENSEN DAVID SEBASTIAN
Format Patent
LanguageChinese
English
Published 13.10.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The disclosed IC package may include: (1) an IC die carrying an electronic circuit; (2) an encapsulation material at least partially covering the IC die wherein (a) the encapsulation material defines a plurality of microchannels within the encapsulation material, and (b) the plurality of microchannels are configured to deliver fluid through the encapsulation material between the one or more microchannel inlets and the one or more microchannel outlets, the one or more microchannel inlets and the one or more microchannel outlets are located outside the encapsulation material; in one embodiment, the system includes (1) a plurality of microchannels, (2) a plurality of microchannels, (3) a plurality of flow valves positioned in the plurality of microchannels, and (4) a plurality of sensors, where each sensor of the plurality of sensors generates a signal indicative of a temperature at a location of the sensor. Various other IC packages and related cooling systems and methods are also disclosed. 所公开的IC封装可以包括：(1)IC管
Bibliography:Application Number: CN202280015618