Semiconductor test structure

• Main Authors: ZENG FANZHONG, SONG YONGLIANG, DONG WEICHUN, LIU QIANQIAN
• Format: Patent
• Language: Chinese; English
• Published: 13.10.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

The invention provides a semiconductor test structure. The semiconductor test structure comprises a communication structure, the communication structure comprises at least two stacked metal layers, each metal layer forms metal strips arranged at intervals, and the corresponding metal strips of two adjacent metal layers are connected through contact holes located at the ends of the metal strips; the virtual metal layer comprises a plurality of virtual metal blocks arranged in an array mode, the projection of each virtual metal block on the communication structure intersects with at least one metal strip, and the contact holes in the ends of the metal strips are exposed. According to the technical scheme, the virtual metal blocks arranged in the array are arranged on the surfaces of the metal strips of the communication structure, the contact holes are prevented from being shielded while the density of the local metal strips is kept, and therefore when the low-light microscope is used, the contact holes can rec