Preparation method of annealing carrier plate and annealing carrier plate

• Main Authors: SHENG KUANG, RAN FEIRONG, XU HONGYI, REN NA
• Format: Patent
• Language: Chinese; English
• Published: 13.10.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to the field of semiconductors, in particular to a preparation method of an annealing carrier plate and the annealing carrier plate. Comprising a carrying disc circular ring and a carrying disc wafer with the light transmittance smaller than that of a wafer to be processed, the carrying disc wafer is provided with a carrying disc circular ring area which is slightly larger than a working area of the wafer to be processed and the outer side, and after the carrying disc circular ring is bonded with the carrying disc circular ring area through a bonding layer, the annealing carrying disc is formed. The carrying disc circular ring is arranged on the outer side of the working area, so that mutual sliding between the to-be-processed wafer and the carrying disc is avoided, and the phenomenon that the to-be-processed wafer slides off due to the influence of airflow during annealing is also reduced; meanwhile, the to-be-processed wafer has certain light transmittance, heat radiation or infrared r