Method for manufacturing support substrate for bonded wafer, and support substrate for bonded wafer

• Main Authors: NONAKA NAOYA, HIEDA DAISUKE, ISHIZAKI HIROAKI, MOROIWA KODAI, ISAMI TOSHIYUKI
• Format: Patent
• Language: Chinese; English
• Published: 10.10.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Provided is a method for manufacturing a support substrate for a bonded wafer in which a substrate for an active layer and a support substrate are bonded with an insulating film interposed therebetween, the method comprising: a support substrate main body preparation step (S21) in which a substrate...