CONDUCTIVE ADHESIVE, SINTERED BODY OF CONDUCTIVE ADHESIVE, METHOD FOR MANUFACTURING SINTERED BODY, ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

• Main Authors: KAWASAKI HIDEYA, KATO RYO, HASHIDATE SUGURU, MORI TAKAMICHI, MINAMI, JUNICHIRO
• Format: Patent
• Language: Chinese; English
• Published: 10.10.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

Provided is a novel conductive adhesive which is capable of obtaining a sintered body having a small specific resistance value even if the adhesive contains a thermosetting resin in addition to silver particles. The conductive adhesive contains silver particles and a thermosetting resin, and the silver particles are provided with a protective layer containing a compound represented by general formula (1). # imgabs0 # [In general formula (1), R1 is an alkyl group having 1-5 carbon atoms, and R2 is a hydrogen atom or an alkyl group having 1-5 carbon atoms. ]. 本发明提供一种新型导电性粘接剂，其即使除了银颗粒之外还包含热固性树脂，也能够得到比电阻值小的烧结体。一种导电性粘接剂，其为包含银颗粒和热固性树脂的导电性粘接剂，所述银颗粒具备包含下述通式(1)所表示的化合物的保护层。#imgabs0#[通式(1)中，R1为碳原子数1～5的烷基，R2为氢原子、或碳原子数1～5的烷基。]。