Preparation method of ceramic substrate containing metalized through holes and product

• Main Authors: ZHANG RUI, HUANG HEJUN, LIU YUTANG, CHEN YAN, GE JIAHUI
• Format: Patent
• Language: Chinese; English
• Published: 03.10.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention relates to a preparation method of a ceramic substrate containing metalized through holes and a product thereof. According to the ceramic substrate containing the metalized through holes, a ceramic material is used as a substrate; a metal circuit is arranged on the front surface and/or the back surface of the substrate; the substrate is provided with a through hole penetrating through the front face and the back face, and conductive paste electrically connected with the surface metal circuit is attached to the hole wall of the through hole. The metalized through holes are prepared by adopting the following scheme: firstly printing conductive slurry on the surface of the ceramic substrate to form a surface metal circuit, then filling the conductive slurry in the through holes in a printing extrusion or negative pressure suction mode, and connecting the conductive slurry to the surface metal circuit; the printed ceramic substrate is placed on a vacuum suction plate with through holes for negative