High-heat-dissipation circuit board and preparation method thereof

The invention relates to the technical field of circuit boards, and discloses a high-heat-dissipation circuit board and a preparation method thereof. The high-heat-dissipation circuit board comprises a cooling fin, a heat conduction insulating layer and a circuit layer. The heat-conducting insulatin...

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Bibliographic Details
Main Authors LIU TONGFA, ZHANG BINBIN, LIAO WEIGUANG, CHO WANG HYUN
Format Patent
LanguageChinese
English
Published 03.10.2023
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The invention relates to the technical field of circuit boards, and discloses a high-heat-dissipation circuit board and a preparation method thereof. The high-heat-dissipation circuit board comprises a cooling fin, a heat conduction insulating layer and a circuit layer. The heat-conducting insulating layer comprises the following raw materials in parts by mass: 90-110 parts of epoxy resin, 15-25 parts of an additive, 10-20 parts of modified granular boron nitride, 8-12 parts of ethylene glycol glycidyl ether and 45-55 parts of a polyamide curing agent; the additive is prepared from the following raw materials in parts by mass: 20 to 30 parts of a reinforcing component, 20 to 30 parts of carboxyl polyimide, 0.05 to 0.1 part of sulfamic acid and 8 to 12 parts of modified flaky boron nitride; the reinforcing component is prepared from the following raw materials in parts by mass: 20 to 30 parts of N-methyldiethanolamine, 6 to 10 parts of hexamethoxymethyl melamine, 0.05 to 0.1 part of sulfamic acid, 60 to 80 par
Bibliography:Application Number: CN202310892099