Wallboard or floor and method for producing wallboard or floor

The invention relates to a floor or wall panel and to a method for producing said floor or wall panel. The invention relates to a wallboard or floor comprising at least one core layer comprising at least one composite material comprising at least one inorganic material and at least one polymeric bin...

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Bibliographic Details
Main Authors BOURNE SIMON, VAN POYER, THOMAS, BELL THEODORUS LUDOVICUS MICHAEL
Format Patent
LanguageChinese
English
Published 03.10.2023
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Summary:The invention relates to a floor or wall panel and to a method for producing said floor or wall panel. The invention relates to a wallboard or floor comprising at least one core layer comprising at least one composite material comprising at least one inorganic material and at least one polymeric binder wherein the weight ratio of the inorganic material to the polymeric binder is at least 2.4: 1. The core layer further includes an additive that is used to improve the performance of the core layer. 本发明涉及一种地板或墙板以及一种用于生产所述地板或墙板的方法。所述墙板或地板包括至少一层包含至少一种复合材料的芯层,所述复合材料包含至少一种无机材料和至少一种聚合物粘合剂,其中所述无机材料与聚合物粘合剂的重量比至少为2.4:1。所述芯层进一步还包含添加剂,其被用于为改善所述芯层的性能。
Bibliography:Application Number: CN202211314239