Mold for granulation device, cutting blade holder for granulation device, cutting blade unit for granulation device, resin cutting device, granulation device, and method for producing resin pellets

• Main Authors: KURIHARA MASAO, SEO MITSUHIRO
• Format: Patent
• Language: Chinese; English
• Published: 29.09.2023
• Subjects: MAKING GRANULES OR PREFORMS; PERFORMING OPERATIONS; PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The invention provides a die for a granulation device, a cutting blade holder for a granulation device, a cutting blade unit for a granulation device, a resin cutting device, and a granulation device, wherein the size of the die can be suppressed even if the throughput capacity is increased. The mold (10) includes a bottom surface (10B), an upper surface (10A) having a smaller radius than the bottom surface (10B), a side surface (10C) connecting an outermost peripheral portion of the bottom surface (10B) and an outermost peripheral portion of the upper surface (10A), and a plurality of mold holes (11) formed in the side surface (10C) for discharging a resin raw material. 本发明提供即使处理量大容量化也能够抑制大型化的造粒装置用模具、造粒装置用切割刃保持器、造粒装置用切割刃单元、树脂切断装置及造粒装置。模具(10)包含底面(10B)、半径小于底面(10B)的上表面(10A)、将底面(10B)的最外周部与上表面(10A)的最外周部连接的侧面(10C)、及形成于侧面(10C)并用于排出树脂原材料的多个模具孔(11)。