SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

• Main Authors: MURAMOTO RYO, NEMOTO SHUHEI, KAZUHIRO SHOJI
• Format: Patent
• Language: Chinese; English
• Published: 26.09.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a substrate processing apparatus for processing a substrate by using a processing liquid in a closed space, and the takt time of the substrate processing apparatus is shortened. The present invention is provided with an atmosphere separation mechanism having an upper sealing member fixed in the vicinity of a ceiling wall of a processing chamber and a lower sealing member provided below the upper sealing member so as to be movable in the vertical direction. The lower sealing member and the upper sealing member enclose the space from the space surrounded by the scattering prevention mechanism to the space of the ceiling wall of the processing chamber to form a sealed space in the processing chamber. In the vertical direction, the lower sealing member is lowered to a lower limit position at which the upper end portion of the lower sealing member and the lower end portion of the upper sealing member coincide with each other or partially overlap with each other, thereby forming a sealed spac