Electronic equipment shell assembly, preparation method thereof and electronic equipment

The invention discloses an electronic equipment shell assembly, a preparation method thereof and electronic equipment. The electronic equipment shell assembly comprises a middle frame, the middle frame comprises a magnesium middle plate, and a resin layer is arranged on the surface of the magnesium...

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Bibliographic Details
Main Authors CHEN JIANG, YIN BIN, HAN ZHONGKAI
Format Patent
LanguageChinese
English
Published 22.09.2023
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Summary:The invention discloses an electronic equipment shell assembly, a preparation method thereof and electronic equipment. The electronic equipment shell assembly comprises a middle frame, the middle frame comprises a magnesium middle plate, and a resin layer is arranged on the surface of the magnesium middle plate; the aluminum outer frame is arranged in the circumferential direction of the magnesium middle plate and is connected with the magnesium middle plate; and at least one part of the plastic part is arranged between the magnesium middle plate and the aluminum outer frame, and the plastic part is provided with an antenna groove. Therefore, the weight of the middle frame can be remarkably reduced, meanwhile, the strength and the appearance surface texture of the middle frame are kept, the machining efficiency is improved, the cost is optimized, and the product competitiveness of the electronic equipment is improved. 本申请公开了电子设备壳体组件及其制备方法、电子设备。其中,电子设备壳体组件包括中框,所述中框包括:镁制中板,所述镁制中板表面设有树脂层;铝制外框,所述铝制外框沿所述镁制中板的周向设置且
Bibliography:Application Number: CN202210253971