Non-conductive flux, connection structure, and method for manufacturing connection structure
The present invention provides a non-conductive flux capable of improving productivity and impact resistance of an obtained connection structure and suppressing the occurrence of solder inflow. The non-conductive flux of the present invention contains an epoxy compound, an acid anhydride curing agen...
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| Main Authors | , |
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| Format | Patent |
| Language | Chinese English |
| Published |
19.09.2023
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The present invention provides a non-conductive flux capable of improving productivity and impact resistance of an obtained connection structure and suppressing the occurrence of solder inflow. The non-conductive flux of the present invention contains an epoxy compound, an acid anhydride curing agent, and an organic phosphorus compound.
本发明提供一种非导电性助焊剂，其能够提高所得到的连接结构体的生产性和耐冲击性，抑制焊料进流的发生。本发明的非导电性助焊剂包含环氧化合物、酸酐固化剂和有机磷化合物。 |
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| AbstractList | The present invention provides a non-conductive flux capable of improving productivity and impact resistance of an obtained connection structure and suppressing the occurrence of solder inflow. The non-conductive flux of the present invention contains an epoxy compound, an acid anhydride curing agent, and an organic phosphorus compound.
本发明提供一种非导电性助焊剂，其能够提高所得到的连接结构体的生产性和耐冲击性，抑制焊料进流的发生。本发明的非导电性助焊剂包含环氧化合物、酸酐固化剂和有机磷化合物。 |
| Author | YASUI HIDEFUMI MATSUSHITA KIYOTO |
| Author_xml | – fullname: MATSUSHITA KIYOTO – fullname: YASUI HIDEFUMI |
| BookMark | eNrjYmDJy89L5WSI8cvP003Oz0spTS7JLEtVSMsprdBRAArkpQIF8vMUikuKgFKlRak6Col5KQq5qSUZ-SkKaflFCrmJeaVpiSC5zLx0rFp4GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakm8s5-hoZm5hbG5gZGjMTFqAFlGPns |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| DocumentTitleAlternate | 非导电性助焊剂、连接结构体及连接结构体的制造方法 |
| ExternalDocumentID | CN116783702A |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_CN116783702A3 |
| IEDL.DBID | EVB |
| IngestDate | Fri Aug 30 05:40:43 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | Chinese English |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_CN116783702A3 |
| Notes | Application Number: CN202280009995 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230919&DB=EPODOC&CC=CN&NR=116783702A |
| ParticipantIDs | epo_espacenet_CN116783702A |
| PublicationCentury | 2000 |
| PublicationDate | 20230919 |
| PublicationDateYYYYMMDD | 2023-09-19 |
| PublicationDate_xml | – month: 09 year: 2023 text: 20230919 day: 19 |
| PublicationDecade | 2020 |
| PublicationYear | 2023 |
| RelatedCompanies | SEKISUI CHEMICAL CO., LTD |
| RelatedCompanies_xml | – name: SEKISUI CHEMICAL CO., LTD |
| Score | 3.6288803 |
| Snippet | The present invention provides a non-conductive flux capable of improving productivity and impact resistance of an obtained connection structure and... |
| SourceID | epo |
| SourceType | Open Access Repository |
| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Non-conductive flux, connection structure, and method for manufacturing connection structure |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230919&DB=EPODOC&locale=&CC=CN&NR=116783702A |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQSTOwSDRMS7PQNTVIttA1STJLBWapZGCfJ9nS1AhYX6aZge8G9PUz8wg18YowjWBiyILthQGfE1oOPhwRmKOSgfm9BFxeFyAGsVzAayuL9ZMygUL59m4hti5q0N4xsD1tCcyBLk62rgH-Lv7Oas7Ots5-an5BtqDpBtA5L0aOzAysoGY06Jx91zAn0K6UAuQqxU2QgS0AaFpeiRADU1WGMAOnM-zmNWEGDl_ohDeQCc17xSIMMX75ebrA3ivogFZgEaWQllNaoaOQDFqoAt6boAA5Cra0KFVHITEvRQFyN7QCsFGqkJuYVwrawQDekohViyiDoptriLOHLtCZ8fAwiXf2Q_jIWIyBJS8_L1WCQcHUJCnNwDQ5McUCWG2nJicB21PgLG0MZCabpZlJMkjhNkcKn6Q0AxcofEFLJQwtZRhYgO5LlQXWxyVJcuCABABONpFE |
| link.rule.ids | 230,309,786,891,25594,76904 |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1NS8NAEB1qFetNq1Lr1wqSU4P9SGJ6CGI3CVGbtEiUHoSQbLOoaFpsi-Kvd3abWg_qbUnYZTPwdmay894AnPK6GTc4N1W9zkxVS4wUIcUw52FtvYn-khuyN6AfGN6ddj3QBwV4XnBhpE7ouxRHREQxxPtUntfj5U8sW9ZWTs6SJ3w0unBDy1by7Bjj6TYi0O5YTr9n96hCqUUDJbi1xHWD0HlpXq7A6jmmhEJn37nvCFbK-KdLcTdhrY-rZdMtKHw-lqFEF53XyrDu5xfeOMyxN9mGh2CUqZi9CoFWPKIIf5l91AgThSqSm0DmUrCzt7RG4mxI5r2hCQal5DXOZoLBICmJv07ZgRPXCamn4jajb5tENFh-UWsXitkoSytAdC3hdZ3FQxPddsoSjKckpFs4ZAY39qD69zrV_14eQ8kL_W7UvQpu9mFD2FqUTTTaB1DEvaaH6JunyZE06hc_j5Qv |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Non-conductive+flux%2C+connection+structure%2C+and+method+for+manufacturing+connection+structure&rft.inventor=MATSUSHITA+KIYOTO&rft.inventor=YASUI+HIDEFUMI&rft.date=2023-09-19&rft.externalDBID=A&rft.externalDocID=CN116783702A |