Non-conductive flux, connection structure, and method for manufacturing connection structure

The present invention provides a non-conductive flux capable of improving productivity and impact resistance of an obtained connection structure and suppressing the occurrence of solder inflow. The non-conductive flux of the present invention contains an epoxy compound, an acid anhydride curing agen...

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Bibliographic Details
Main Authors MATSUSHITA KIYOTO, YASUI HIDEFUMI
Format Patent
LanguageChinese
English
Published 19.09.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention provides a non-conductive flux capable of improving productivity and impact resistance of an obtained connection structure and suppressing the occurrence of solder inflow. The non-conductive flux of the present invention contains an epoxy compound, an acid anhydride curing agent, and an organic phosphorus compound. 本发明提供一种非导电性助焊剂，其能够提高所得到的连接结构体的生产性和耐冲击性，抑制焊料进流的发生。本发明的非导电性助焊剂包含环氧化合物、酸酐固化剂和有机磷化合物。
Bibliography:Application Number: CN202280009995