METHOD OF FORMING PACKAGE AND PACKAGE

Embodiments of the present application provide a method of forming a package, the method including bonding a photon engine to an interposer, and bonding a package component to the interposer. The package assembly includes a device die. The method further includes encapsulating the encapsulation asse...

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Bibliographic Details
Main Authors XIA XINGGUO, CHAO RUILIN, YU ZHIGUANG, YU ZHENHUA
Format Patent
LanguageChinese
English
Published 19.09.2023
Subjects
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
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Summary:Embodiments of the present application provide a method of forming a package, the method including bonding a photon engine to an interposer, and bonding a package component to the interposer. The package assembly includes a device die. The method further includes encapsulating the encapsulation assembly and the photon engine in an encapsulant, connecting the thermoelectric cooler to the photon engine, and connecting the metal cap to the encapsulation assembly. In accordance with other embodiments of the present application, a package is also provided. 本申请的实施例提供了一种形成封装件的方法，该方法包括将光子引擎接合到中介层上，以及将封装组件接合到中介层上。封装组件包括器件管芯。该方法还包括将封装组件和光子引擎封装在密封剂中，将热电冷却器连接到光子引擎，以及将金属盖连接到封装组件。根据本申请的其他实施例，还提供了封装件。
Bibliography:Application Number: CN202310460716