Wafer resistive film preparation device and preparation method
The invention relates to the technical field of resistors, and discloses a wafer resistive film preparation device and a preparation method, the wafer resistive film preparation device comprises a roller, a driving device, a baffle plate, an electron gun and a crucible, the driving device drives the...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
19.09.2023
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Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to the technical field of resistors, and discloses a wafer resistive film preparation device and a preparation method, the wafer resistive film preparation device comprises a roller, a driving device, a baffle plate, an electron gun and a crucible, the driving device drives the roller to rotate so as to drive a ceramic rod in the roller to continuously move, the electron gun faces a crucible evaporation source, and the baffle plate is switched between an opening position and a closing position. The method has the beneficial effects that the thickness of the resistive film can be accurately controlled, the process is easy to control, the repeatability is good, the reliability, the stability and the like are superior to those of a resistive film and a chip fixed resistor which are subjected to roller sputtering deposition, the preparation method is simpler and more efficient, and the adaptability is good.
本发明涉及电阻器技术领域,公开了一种晶圆电阻膜制备装置以及制备方法,包括滚筒、驱动装置、挡板、电子枪和坩埚,驱动装置带动滚筒转动,进而带动滚筒内的陶瓷棒不断运动,电子枪朝 |
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Bibliography: | Application Number: CN202310747783 |