Compression ratio matching method for automobile BDU cushion pad and heat conduction pad

• Main Authors: SHAO RENQIANG, ZHANG HUI, YAN ZUDONG, PU XIAOYONG, DU ZHAOHUI, YAN JUNFEI
• Format: Patent
• Language: Chinese; English
• Published: 19.09.2023
• Subjects: CALCULATING; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; PHYSICS

The invention relates to a compression ratio matching method for a buffer pad and a heat-conducting pad of an automobile BDU, which is characterized by comprising the following steps: S1, modeling the BDU in modeling software, and completing the installation of a steel jacket, the buffer pad and the heat-conducting pad; s2, respectively obtaining corresponding compression stresses and rebound rates of the buffer pad and the heat conducting pad under different compression rates through a compression experiment; s3, the stress of the buffer pad and the minimum thickness of the heat conduction pad are determined; s4, calculating a size chain of the heat conduction pad; and S5, performing a simulation experiment on the heat-conducting pad to obtain a dynamic compression ratio of the heat-conducting pad, judging whether the preset compression ratio of the buffer pad in the step S3 is appropriate or not according to the dynamic compression ratio, if so, proving that the compression ratios of the buffer pad and the