Circuit board electrogilding liquid and preparation method thereof

• Main Authors: LIU TONGFA, ZHANG JIYOU, LIAO WEIGUANG, CHO WANG HYUN
• Format: Patent
• Language: Chinese; English
• Published: 19.09.2023
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention relates to the technical field of electroplating, and discloses a circuit board electrogilding solution and a preparation method thereof. The electroplating liquid comprises the following components according to the concentration: 10-20 g/L of sodium gold sulfite, 30-40 g/L of a main coordination agent, 15-20 g/L of an auxiliary coordination agent, 5-10 g/L of sodium carbonate, 15-25 g/L of sodium hydroxide and the balance of water. The main coordination agent is prepared from the following raw materials in parts by mass: 20 to 30 parts of diallylmethylamine, 8 to 14 parts of epoxy chloropropane, 2 to 3 parts of chitosan and 20 to 30 parts of modifier; the auxiliary coordination agent is prepared from the following raw materials in parts by mass: 20 to 30 parts of diallyl methylamine, 8 to 14 parts of epoxy chloropropane, 0.1 to 0.2 part of an initiator and 15 to 25 parts of 6-amino-2-thiouracil; the main coordination agent and the auxiliary coordination agent act together to obtain a high-quali