CONDUCTIVE MEMBER, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE
The conductive member (1) is provided with an adhesive layer (10) and a metal foil layer (20). The adhesive layer (10) is formed from an adhesive composition (14) containing conductive particles (12). The metal foil layer (20) is disposed on the adhesive layer (10). The conductive member (1) can be...
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| Main Authors | , , , , , , , |
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| Format | Patent |
| Language | Chinese English |
| Published |
15.09.2023
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The conductive member (1) is provided with an adhesive layer (10) and a metal foil layer (20). The adhesive layer (10) is formed from an adhesive composition (14) containing conductive particles (12). The metal foil layer (20) is disposed on the adhesive layer (10). The conductive member (1) can be used, for example, for forming a predetermined metal film.
导电性部件(1)具备黏合剂层(10)及金属箔层(20)。黏合剂层(10)由含有导电性粒子(12)的黏合剂组合物(14)形成。金属箔层(20)配置于黏合剂层(10)上。该导电性部件(1)例如能够用于形成规定的金属膜。 |
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| AbstractList | The conductive member (1) is provided with an adhesive layer (10) and a metal foil layer (20). The adhesive layer (10) is formed from an adhesive composition (14) containing conductive particles (12). The metal foil layer (20) is disposed on the adhesive layer (10). The conductive member (1) can be used, for example, for forming a predetermined metal film.
导电性部件(1)具备黏合剂层(10)及金属箔层(20)。黏合剂层(10)由含有导电性粒子(12)的黏合剂组合物(14)形成。金属箔层(20)配置于黏合剂层(10)上。该导电性部件(1)例如能够用于形成规定的金属膜。 |
| Author | FUJIMOTO DAISUKE AKAI KUNIHIKO ITO YUKA TAKANO, NOZOMU OKOSHI MASASHI IZAWA HIROYUKI KOTAKE TOMOHIKO TAKAGI SHUNSUKE |
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| DocumentTitleAlternate | 导电性部件、电子装置的制造方法、连接结构体及电子装置 |
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| RelatedCompanies | LISEN NOCO CO., LTD |
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| Snippet | The conductive member (1) is provided with an adhesive layer (10) and a metal foil layer (20). The adhesive layer (10) is formed from an adhesive composition... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | CONDUCTIVE MEMBER, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE |
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