CONDUCTIVE MEMBER, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE

The conductive member (1) is provided with an adhesive layer (10) and a metal foil layer (20). The adhesive layer (10) is formed from an adhesive composition (14) containing conductive particles (12). The metal foil layer (20) is disposed on the adhesive layer (10). The conductive member (1) can be...

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Main Authors ITO YUKA, TAKANO, NOZOMU, IZAWA HIROYUKI, KOTAKE TOMOHIKO, FUJIMOTO DAISUKE, OKOSHI MASASHI, AKAI KUNIHIKO, TAKAGI SHUNSUKE
Format Patent
LanguageChinese
English
Published 15.09.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The conductive member (1) is provided with an adhesive layer (10) and a metal foil layer (20). The adhesive layer (10) is formed from an adhesive composition (14) containing conductive particles (12). The metal foil layer (20) is disposed on the adhesive layer (10). The conductive member (1) can be used, for example, for forming a predetermined metal film. 导电性部件(1)具备黏合剂层(10)及金属箔层(20)。黏合剂层(10)由含有导电性粒子(12)的黏合剂组合物(14)形成。金属箔层(20)配置于黏合剂层(10)上。该导电性部件(1)例如能够用于形成规定的金属膜。
Bibliography:Application Number: CN20228010353