Conductive interconnection chemical plating activating agent and preparation method and application thereof

• Main Authors: LUO JINGLI, YE CHUNYI, FU XIANZHU
• Format: Patent
• Language: Chinese; English
• Published: 15.09.2023
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The invention discloses a conductive interconnection chemical plating activating agent and a preparation method and application thereof, and the preparation method comprises the following steps: providing a pure copper activating agent; the preparation method comprises the following steps: mixing chloropalladic acid with disodium ethylene diamine tetraacetate, and preparing a chloropalladic acid solution after the disodium ethylene diamine tetraacetate is completely dissolved; and adding the chloropalladic acid solution into a pure copper activating agent, and stirring at room temperature, so that palladium in the chloropalladic acid solution can be reduced on the surfaces of copper nanoparticles in the pure copper activating agent, and the Cu-coated Pd colloid activating agent with the core-shell structure, namely the conductive interconnection chemical plating activating agent, is prepared. The Cu-coated Pd activating agent with the core-shell structure is prepared on the basis of a pure copper activating a