Data line and glue filling device and manufacturing method thereof

• Main Authors: ZHANG XIANSHENG, SUN ANPING, KE BO, YANG TONGJU
• Format: Patent
• Language: Chinese; English
• Published: 12.09.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CURRENT COLLECTORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINE CONNECTORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention provides a data line and a glue filling device and a manufacturing method thereof. The data line is provided with a circuit board, a wire rod and a shell, the wire rod is connected to the circuit board, the shell is provided with an opening and a wire outlet hole, and the data line glue pouring device comprises a base; the shell fixing unit is arranged on the base and used for fixing the shell, and the wire rod penetrates through the wire outlet hole; the circuit board fixing unit is arranged on the base and is used for fixing the circuit board; the glue injection unit is arranged on the base and is used for injecting glue into the shell through the opening; after the glue injection unit completes glue injection, the circuit board fixing unit releases the circuit board, and the circuit board moves into the shell. 本发明提供一种数据线及其灌胶装置、制造方法。数据线具有线路板、线材以及外壳，所述线材连接于所述线路板，所述外壳具有一开口及一出线孔，数据线灌胶装置包括一基座；一外壳固定单元，设置于所述基座，用于固定所述外壳，所述线材穿设于所述出线孔；一线路板固定单元，设置于所述基座，用于固定所述线路板；一注胶单元，设置于所述基座，用于通过所述开口向所述外壳内注胶；其中所述注胶单元完成