Method and device for detecting internal flaws of wafer

• Main Author: HUANG YINGJUN
• Format: Patent
• Language: Chinese; English
• Published: 05.09.2023
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING

The invention provides a wafer internal flaw detection method and device, and the method comprises the following steps: generating a light beam through a light source generation unit; an optical coupling unit is used for coupling the light beams and then the light beams are emitted into the wafer fr...