Method and device for detecting internal flaws of wafer

• Main Author: HUANG YINGJUN
• Format: Patent
• Language: Chinese; English
• Published: 05.09.2023
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING

The invention provides a wafer internal flaw detection method and device, and the method comprises the following steps: generating a light beam through a light source generation unit; an optical coupling unit is used for coupling the light beams and then the light beams are emitted into the wafer from the side face of the wafer; acquiring data reflected by light beams in the wafer through a light sensing unit; generating a wafer image by an imaging unit according to the data reflected by the light beam in the wafer; and acquiring and analyzing light beam scattering data in the wafer by an image processing unit according to the wafer image, and judging whether flaws exist in the wafer or not. Light beams are coupled through the light source coupling unit and then enter the wafer from the side face of the wafer, internal reflection of the light beams in the wafer is designed as a main propagation mode, then the wafer image is generated through the image processing unit, and finally the area where light scatteri