Semiconductor emergency refrigeration device

• Main Authors: LUO HAI, LI HUICHENG, ZHEN CHANGHONG, MA HONGXIAO
• Format: Patent
• Language: Chinese; English
• Published: 05.09.2023
• Subjects: BEARINGS; BLASTING; COLD ROOMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS; ELEMENTS OR CRANKSHAFT MECHANISMS; ENGINEERING ELEMENTS AND UNITS; FLEXIBLE SHAFTS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS; HEAT PUMP SYSTEMS; HEATING; ICE-BOXES; LIGHTING; LIQUEFACTION SOLIDIFICATION OF GASES; MANUFACTURE OR STORAGE OF ICE; MECHANICAL ENGINEERING; REFRIGERATION MACHINES, PLANTS OR SYSTEMS; REFRIGERATION OR COOLING; REFRIGERATORS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; SHAFTS; THERMAL INSULATION IN GENERAL; WEAPONS

The invention provides a semiconductor emergency refrigeration device. The semiconductor emergency refrigeration device comprises a machine shell, a fan assembly arranged in the machine shell, a heat exchange assembly arranged in the machine shell and a walking mechanism arranged at the bottom of the machine shell. An air supply channel and a heat dissipation cavity are formed in the machine shell, the heat exchange assembly comprises a heat exchange pipeline and multiple sets of semiconductor refrigeration modules, the heat exchange pipeline is arranged in the machine shell, the heat dissipation cavity is arranged around the heat exchange pipeline, and the multiple sets of semiconductor refrigeration modules are arranged on the heat exchange pipeline. And the heat exchange pipes are sequentially arranged from top to bottom along the heat exchange pipes. According to the semiconductor emergency refrigeration device, airflow generated by the fan assembly can be rapidly refrigerated through the semiconductor re