Application of indole amide ligand in carbon-nitrogen coupling reaction

• Main Authors: XU TINGHUA, CHEN BIN, LI YUANQIANG, FENG KAIXIANG, YAN PUCHA
• Format: Patent
• Language: Chinese; English
• Published: 05.09.2023
• Subjects: CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY; CHEMISTRY; HETEROCYCLIC COMPOUNDS; METALLURGY; ORGANIC CHEMISTRY; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; THEIR RELEVANT APPARATUS; TRANSPORTING

The invention relates to an application of an indole amide ligand in a C-N bond coupling reaction. The indole amide ligand is used for preparing an aromatic nitrogen heterocyclic compound. The compound is prepared by reacting a chlorinated aromatic heterocyclic compound and a nitrogen heterocyclic compound under the participation of an indole amide ligand and the action of a cuprous catalyst, the structural formula of the indole amide ligand is shown in the specification, and the cuprous catalyst is a cuprous salt compound. 本发明涉及吲哚酰胺配体在C-N键偶联反应的应用，用于制备芳杂氮杂环类化合物。由氯代芳杂环化合物和氮杂环类化合物反应制备，在吲哚酰胺配体参与及亚铜催化剂作用下进行，其中，吲哚酰胺配体的结构式为：所述亚铜催化剂为亚铜盐类化合物。