Drying and cleaning equipment

• Main Authors: DUAN BINBIN, QIAN CHENG, TONG JIAN
• Format: Patent
• Language: Chinese; English
• Published: 01.09.2023
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; DRYING; DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEATING; LIGHTING; MECHANICAL ENGINEERING; SEMICONDUCTOR DEVICES; WEAPONS

The invention relates to a drying and cleaning device which comprises a wafer lifting mechanism, an air nozzle of the wafer lifting mechanism is arranged on a wafer supporting seat, when the wafer supporting seat rises to the topmost end and a wafer is placed in a cover body, the air nozzle is located at the position capable of being close to the wafer in the cover body, drying gas can be directly blown to the wafer, and therefore the wafer can be directly cleaned. And the drying efficiency of the wafer and the drying effect in the same time are improved. 本申请涉及一种干燥清洗设备，其中包括晶圆升降机构，晶圆升降机构的喷气口设置于晶圆支撑座上，当晶圆支撑座升高到最顶端而将晶圆置于盖体内时，喷气口处于能够离盖体内的晶圆较近的位置，干燥气体能够直接喷吹到晶圆上，提高晶圆的干燥效率和相同时间下的干燥效果。