WIRING CIRCUIT BOARD
This printed circuit board (X1) is provided with a metal support substrate (10), an insulating layer (20), and a conductor layer (30) in this order in the thickness direction (T). The conductor layer (30) includes at least one terminal portion (31) and a wiring portion (32) extending from the termin...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
29.08.2023
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Subjects | |
Online Access | Get full text |
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Summary: | This printed circuit board (X1) is provided with a metal support substrate (10), an insulating layer (20), and a conductor layer (30) in this order in the thickness direction (T). The conductor layer (30) includes at least one terminal portion (31) and a wiring portion (32) extending from the terminal portion (31). The metal support substrate (10) has an opening (10A). The opening portion (10A) penetrates through the metal support substrate (10) in the thickness direction (T) and faces the terminal portion (31) via the insulating layer (20). The opening (10A) has a first opening peripheral edge (11) on one side in the thickness direction (T) and a second opening peripheral edge (12) on the other side in the thickness direction (T). The second opening peripheral edge (12) is disposed on the outside of the first opening peripheral edge (11) and extends along the first opening peripheral edge (11) when viewed in a projection in the thickness direction (T).
本发明的布线电路基板(X1)在厚度方向(T)上依次具备金属支承基板(10)、绝缘层(20)和导体层(30)。导体 |
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Bibliography: | Application Number: CN202180089615 |