Polishing pad

• Main Authors: SHOJI KAZUO, KINOSHITA OSAMU
• Format: Patent
• Language: Chinese; English
• Published: 29.08.2023
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

Provided is a polishing pad with which it is possible to stably achieve requirements and finishing quality for an object to be polished with strict product specifications. A polishing pad comprising a foam containing substantially spherical bubbles is characterized in that the density of the pad constituting material is within the range of 0.36 DM to 0.70 DM (inclusive), where DM g/cm3 is the density of the pad constituting material, and the deviation (standard deviation [sigma] 1) of the opening diameter of the bubbles formed on the surface of the polishing pad is adjusted to 45 [mu] m or less. The diameter deviation (standard deviation [sigma] 2) formed on the surface of the polishing pad when a circular approximation is performed on the basis of the area of the portion surrounded by the openings of the bubbles is adjusted to 35 [mu] m or less, and the bubbles included in the foam may be independent bubbles or continuous bubbles. 提供能够稳定地实现制品规格变得严格的研磨对象物的要求·精加工品质的研磨垫。由包含大致球状的气泡的发泡体构成的研磨垫，其特征在于，将垫构成材料的密度设为DMg