Positioning mechanism for semiconductor chip production

The invention discloses a positioning mechanism for semiconductor chip production, which comprises a machine body, a wafer is placed on the inner side of the machine body, a positioning part capable of positioning the wafer is arranged on the inner side of the machine body, the positioning part comp...

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Bibliographic Details
Main Author CHEN BINGGUI
Format Patent
LanguageChinese
English
Published 29.08.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention discloses a positioning mechanism for semiconductor chip production, which comprises a machine body, a wafer is placed on the inner side of the machine body, a positioning part capable of positioning the wafer is arranged on the inner side of the machine body, the positioning part comprises a placing part and a centering part arranged on the inner side of the machine body and above the placing part, and the centering part corresponds to the placing part. The centering part and the placing part are coaxially arranged, the centering part can be arranged on the outer side of the placing part in a sleeving mode, the centering part extends outwards to be provided with a fixing structure, and a communicating structure is installed on the inner side of the fixing structure to communicate the centering part with the machine body. According to the invention, by arranging the placing part and the centering part which can position the wafer in the wafer placing process, cooperation is formed in the use pro
Bibliography:Application Number: CN202310685178