Semiconductor silicon wafer processing and cooling equipment

• Main Authors: DING MINGXING, LI XINHUI, XU JIANFENG
• Format: Patent
• Language: Chinese; English
• Published: 29.08.2023
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

The invention relates to the technical field of semiconductor processing, in particular to semiconductor silicon wafer processing cooling equipment which comprises a processing table, a cooling base used for placing a wafer is arranged at the upper end of the processing table, a vertical guide rail is fixedly arranged at the end, close to the processing table, of a movable side plate, and a mounting base is slidably mounted on the vertical guide rail in a matched mode. An air cylinder seat is fixedly arranged on one side of the mounting seat, a rotating air cylinder is fixedly arranged in the air cylinder seat, the output end of the rotating air cylinder is fixedly connected with a grinding tool apron, a plurality of grinding tooth blades are arranged on the edge of the bottom of the grinding tool apron at equal intervals in the circumferential direction, the top end of the grinding tool apron is rotationally mounted in a fixing seat, and grinding cooling assemblies are symmetrically arranged on the two sides