RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, AND SEMICONDUCTOR DEVICE

• Main Author: OGAWA MICHIHIRO
• Format: Patent
• Language: Chinese; English
• Published: 25.08.2023
• Subjects: APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

The present invention provides a resin composition containing a cyclized resin or a precursor thereof and a nitrogen-containing compound, a cured product obtained by curing the resin composition, a laminate comprising the cured product, a method for producing the cured product, and a semiconductor device comprising the cured product or the laminate, the nitrogen-containing compound includes a nitrogen-containing heterocyclic ring and an amino group in the same compound, one hydrogen atom in the amino group may be substituted, and at least one nitrogen atom that is a ring member of the nitrogen-containing heterocyclic ring is directly bonded to a carbonyl group, a sulfonyl group, or a thiocarbonyl group. 本发明提供一种树脂组合物、将上述树脂组合物固化而成的固化物、包含上述固化物的层叠体、上述固化物的制造方法及包含上述固化物或上述层叠体的半导体器件，该树脂组合物包含环化树脂或其前体及含氮化合物，上述含氮化合物将含氮杂环和氨基包含在同一化合物内，上述氨基的氢原子中的1个可以被取代，作为上述含氮杂环的环元的氮原子中的至少1个与羰基、磺酰基或硫羰基直接键合。