Packaging structure and method

The invention discloses a packaging structure and method, and the structure comprises an organic substrate, the upper surface of the organic substrate is welded with a chip, and the upper surface of the chip is bonded with a cooling fin; and a welding column is welded on the lower surface of the org...

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Bibliographic Details
Main Authors XU LIEWEI, ZHOU HAIYING, YU JUN
Format Patent
LanguageChinese
English
Published 25.08.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The invention discloses a packaging structure and method, and the structure comprises an organic substrate, the upper surface of the organic substrate is welded with a chip, and the upper surface of the chip is bonded with a cooling fin; and a welding column is welded on the lower surface of the organic substrate. According to the scheme, the service life of the welding spot can be prolonged, and the packaging requirement of a high-performance chip is met. 本发明公开了一种封装结构及方法，该封装结构包括：有机基板，所述有机基板的上表面焊接有芯片，所述芯片的上表面粘结有散热片；所述有机基板的下表面焊接有焊柱。利用本发明方案，可以提高焊点寿命，满足高性能芯片的封装需求。
Bibliography:Application Number: CN202210139700