Signal spectrum selection-free heat insulation film and preparation process thereof
The invention belongs to the technical field of film materials, and particularly relates to a signal spectrum selection-free heat insulation film and a preparation process thereof. The heat insulation film provided by the invention comprises a release film, an ultraviolet blocking pressure-sensitive...
Saved in:
Main Authors | , , , , , |
---|---|
Format | Patent |
Language | Chinese English |
Published |
25.08.2023
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | The invention belongs to the technical field of film materials, and particularly relates to a signal spectrum selection-free heat insulation film and a preparation process thereof. The heat insulation film provided by the invention comprises a release film, an ultraviolet blocking pressure-sensitive adhesive layer, a second polyester layer, a spectrum selection heat insulation layer, a first polyester layer and a scratch-resistant layer from inside to outside, wherein the spectrum selection thermal insulation layer contains a thermal insulation material, an adhesive, a titanium nitride compound, a curing agent and a solvent; and the thermal insulation material is modified doped tungsten oxide. The heat insulation window film with the spectrum selection function and without blocking the signals, provided by the invention, has a composite structure and is formed by integrally compounding a scratch-resistant layer, a first polyester film or polycarbonate film base material, a spectrum selection heat insulation a |
---|---|
AbstractList | The invention belongs to the technical field of film materials, and particularly relates to a signal spectrum selection-free heat insulation film and a preparation process thereof. The heat insulation film provided by the invention comprises a release film, an ultraviolet blocking pressure-sensitive adhesive layer, a second polyester layer, a spectrum selection heat insulation layer, a first polyester layer and a scratch-resistant layer from inside to outside, wherein the spectrum selection thermal insulation layer contains a thermal insulation material, an adhesive, a titanium nitride compound, a curing agent and a solvent; and the thermal insulation material is modified doped tungsten oxide. The heat insulation window film with the spectrum selection function and without blocking the signals, provided by the invention, has a composite structure and is formed by integrally compounding a scratch-resistant layer, a first polyester film or polycarbonate film base material, a spectrum selection heat insulation a |
Author | BEN XIAOYAN WANG LANFANG WANG CHENXIN LIU FAN WANG XIN ZHAO QIANGGUO |
Author_xml | – fullname: WANG XIN – fullname: LIU FAN – fullname: WANG LANFANG – fullname: ZHAO QIANGGUO – fullname: WANG CHENXIN – fullname: BEN XIAOYAN |
BookMark | eNqNijsOwjAQBV1Awe8OywEiET7pUQSiogl9tArPiSVnbXmd-wOCA1DNaDRLM5MgWJimcb2wJ43ocppGUvi3uSCFTQAN4ExOdPL8iWSdH4nlSTEhcvrGmEIHVcoDEoJdm7llr9j8uDLb6-VR3wrE0EIjdxDktr6XZVUdd6d9dT7887wA3O860A |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | 一种不阻隔信号光谱选择隔热膜及其制备工艺 |
ExternalDocumentID | CN116640526A |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_CN116640526A3 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 14:01:55 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | Chinese English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_CN116640526A3 |
Notes | Application Number: CN202310774856 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230825&DB=EPODOC&CC=CN&NR=116640526A |
ParticipantIDs | epo_espacenet_CN116640526A |
PublicationCentury | 2000 |
PublicationDate | 20230825 |
PublicationDateYYYYMMDD | 2023-08-25 |
PublicationDate_xml | – month: 08 year: 2023 text: 20230825 day: 25 |
PublicationDecade | 2020 |
PublicationYear | 2023 |
RelatedCompanies | CHANGZHOU SANYOU DISSAN PROTECTIVE MATERIAL MANUFACTURING CO., LTD |
RelatedCompanies_xml | – name: CHANGZHOU SANYOU DISSAN PROTECTIVE MATERIAL MANUFACTURING CO., LTD |
Score | 3.600098 |
Snippet | The invention belongs to the technical field of film materials, and particularly relates to a signal spectrum selection-free heat insulation film and a... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES |
Title | Signal spectrum selection-free heat insulation film and preparation process thereof |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230825&DB=EPODOC&locale=&CC=CN&NR=116640526A |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8gGvVNUaP4kZqYvS0y2MZ8WIx0I8SEQQQNb6RlLWJkW2DGxL_eaxnii741bdNcr7n27nr3O4Abxmsud2rcRG2CmTZOM1nMGmbDYzL2RJMxjc7fjdzOs_04ckYleFvnwmic0E8NjogSNUF5z_V9nW2cWIGOrVze8hl2pfftoR8YhXVcV-ArjhG0_LDfC3rUoNSnkRE9-ZblurbCNnnYgm2lRiuc_fClpbJSst9PSvsAdvq4WpIfQunrtQJ7dF15rQK73eLDG5uF7C2PYDCYTfHUic6NXHzMyVKXsEFSTbkQgqhblejQck0_kbP3OWFJTLKFWAF8Y2e2ygsgSu0TqTyG63Y4pB0TqRv_sGJMo81GGidQTtJEnAJR5YbY3cSOXZvbTSHRqELLh3vKodG0pDyD6t_rVP8bPId9xVblRa07F1DG_YlLfIZzfqX59w1SYI41 |
link.rule.ids | 230,309,786,891,25594,76906 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LTwIxEJ4gGvGmqEF81cTsbSOPfXnYGOlCUGEhgoYbadlWMbJsFoyJv95pAfGit6Ztmuk0085MZ74BuGS85HC7xE3UJphp4TSTRaxqVj0mI0-4jGl0_nboNJ-s-4E9yMDbKhdG44R-anBElKgRyvtc39fJ2okV6NjK2RUfY9f0ptH3A2NpHVcU-IptBDW_3u0EHWpQ6tPQCB_9ctlxLIVtcrsBm65C51Wq03NNZaUkv5-Uxi5sdXG1eL4Hma_XPOToqvJaHrbbyw9vbC5lb7YPvd74BU-d6NzI9GNCZrqEDZJqylQIom5VokPLNf1Ejt8nhMURSVKxAPjGzmSRF0CU2iem8gAuGvU-bZpI3fCHFUMarjdSPYRsPI1FAYgqN8SuR1bkWNxyhUSjCi0f7imHhluW8giKf69T_G_wHHLNfrs1bN2FD8ewo1isPKoV-wSyuFdxik_ynJ9pXn4DIdKRIg |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Signal+spectrum+selection-free+heat+insulation+film+and+preparation+process+thereof&rft.inventor=WANG+XIN&rft.inventor=LIU+FAN&rft.inventor=WANG+LANFANG&rft.inventor=ZHAO+QIANGGUO&rft.inventor=WANG+CHENXIN&rft.inventor=BEN+XIAOYAN&rft.date=2023-08-25&rft.externalDBID=A&rft.externalDocID=CN116640526A |